TF Securities analyst Ming-Chi Kuo has just published a new report regarding the future of iPhones. He mentions the arrival of RCC technology (a resin coated with copper) which should make it possible to reduce the size of printed circuits in iPhones.
According to the latest information from Ming-Chi Kuo, Apple would not be ready to introduce RCC technology next year in itsiPhone 16 Pro. We would therefore have to wait until 2025 and the arrival of the iPhone 17 Pro to see this new technology make its entry into the list of iPhone components.
In his report Kuo explains that currently only one company, Ajinomoto, is able to supply RCC materials in large quantities, so it is the only possible partner for Apple. Still according to Kuo, the two companies are discussing a joint alliance and if these exchanges are successful before the 3rd quarter of 2024 it would then be possible to find RCC motherboards in the iPhone 17 Pro at the start of the 2025 school year. .
The RCC, a revolution in the making ?
The arrival of RCC in iPhones is no longer in doubt in the long term. This technology has many advantages compared to fiberglass which is today used by the Apple brand to cover its motherboards in iPhones.
But Apple wants to do things in the right order and the Cupertino company still has some doubts about the “fragility” of this technology. For the moment the RCC has not managed to pass the internal drop tests and Apple must find a solution to consolidate it before using it.
With the RCC several analysts believe that Apple will be able to gain precious millimeters in the heart of its phones. The Apple brand could then review the arrangement of the components and thus givethe iPhone of tomorrow a new look.
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By : Keleops AG
